I have asked the support, as expected the answer from you is not useful.
I have now received mine and the hole spacing is l=52mm w=42mm.
The height of the component to be cooled is 2.2mm.
Attention: If you want to mount the heat sink directly on the component, you have to slightly mill off the heat sink at one point, because another component is higher.
The gap with the original distance (chip to heat sink) is 0.8mm - therefore it is best to put a copper plate of this thickness in between.

wenn du hier nicht fündig wirst melde dich beim asus support....https://www.asus.com/ch-de...